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GM-DID Semiconducting insulation semiconducting three-layer composite heat shrinkable tube for tube bus

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Introduction        
It is made of semi-rigid polyolefin, the inner and outer layers are made of semi-conductive heat-shrinkable material, and the middle layer is made of insulating heat-shrinkable material, namely semi-conducting, insulating and semi-conducting three-layer composite heat-shrinkable tube. Suitable for 6~36kV voltage transmission and distribution tubular bus, semi-conductive and semi-conductive layers are in contact with each other to reduce partial discharge; the multi-layer heat-shrinkable tube tower structure is sleeved on the tube bus, and the two ends of each layer of heat-shrinkable tube grow outside In the part of the layer, the semiconducting layer is stripped and cut to avoid the creepage between the semiconducting layers. At the same time, the voltage is effectively shared between each layer to achieve the design effect of tube bus insulation and elimination of electrical stress.

 

Features        
Operating temperature: -40~105         
Voltage level: 1~36kV        
Halogen-free and environmentally friendly, RoHS compliant        
Minimum full shrinkage temperature: 135         
Shrink ratio : 2:1        
Standard color: black (outer layer) / red (middle layer) / black (inner layer)        

 

Technical Data        
Property Test method Values    
Intermediate layer (red insulating layer)        
Tensile Strength ASTM D2671 ≥14 MPa    
Breakdown elongation ASTM D2671 ≥400%    
Aging(136/168h)
Tensile Strength
Breakdown elongation
ASTM D2671
≥10.8 MPa
≥300%
   
Water absorption (23/24h) ASTM D570 ≤0.5%    
Low temperature flexibility (-40/4h) ASTM D2671 No cracks    
Heat shock(200/4h) ASTM D2671 No drips, no flow, no cracks    
Dielectric strength ASTM D2671 ≥16 kV/mm    
Volume resistivity ASTM D2671 ≥1.0×1013 Ω·cm    
Outer layer/inner layer (black semiconducting layer)        
Tensile Strength ASTM D2671 ≥12 MPa    
Breakdown elongation ASTM D2671 ≥300%    
Aging(136/168h)
Tensile Strength
Breakdown elongation
ASTM D2671
≥9.0 MPa
≥220%
   
Water absorption (23/24h) ASTM D570 ≤0.5%    
Low temperature flexibility (-40/4h) ASTM D2671 No cracks    
Heat shock(200/4h) ASTM D2671 No drips, no flow, no cracks    
Volume resistivity ASTM D2671 ≤5×103 Ω·cm    

 

Dimesion        
Size As supplied(mm) After shrink (mm) Standard length
GM-DID Inner diameterMin. Inner diameterMax. Wall thicknesscommon m/roll
100 100 55 2.7 6~24
120 120 65 2.7 6~24
130 130 70 2.7 6~24
140 140 75 2.7 6~24
150 150 80 2.7 6~24
180 180 85 2.7 6~24
200 200 90 2.7 6~24

 

 

 

 

 

 

 

 

 

 

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GM-DID Semiconducting insulation semiconducting three-layer composite heat shrinkable tube for tube bus
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