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GM-DID Semiconducting insulation semiconducting three-layer composite heat shrinkable tube for tube bus
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| Introduction | ||||
| It is made of semi-rigid polyolefin, the inner and outer layers are made of semi-conductive heat-shrinkable material, and the middle layer is made of insulating heat-shrinkable material, namely semi-conducting, insulating and semi-conducting three-layer composite heat-shrinkable tube. Suitable for 6~36kV voltage transmission and distribution tubular bus, semi-conductive and semi-conductive layers are in contact with each other to reduce partial discharge; the multi-layer heat-shrinkable tube tower structure is sleeved on the tube bus, and the two ends of each layer of heat-shrinkable tube grow outside In the part of the layer, the semiconducting layer is stripped and cut to avoid the creepage between the semiconducting layers. At the same time, the voltage is effectively shared between each layer to achieve the design effect of tube bus insulation and elimination of electrical stress. | ||||
| Features | ||||
| Operating temperature: -40~105 ℃ | ||||
| Voltage level: 1~36kV | ||||
| Halogen-free and environmentally friendly, RoHS compliant | ||||
| Minimum full shrinkage temperature: 135 ℃ | ||||
| Shrink ratio : 2:1 | ||||
| Standard color: black (outer layer) / red (middle layer) / black (inner layer) |
| Technical Data | ||||
| Property | Test method | Values | ||
| Intermediate layer (red insulating layer) | ||||
| Tensile Strength | ASTM D2671 | ≥14 MPa | ||
| Breakdown elongation | ASTM D2671 | ≥400% | ||
| Aging(136℃/168h) Tensile Strength Breakdown elongation |
ASTM D2671 | ≥10.8 MPa ≥300% |
||
| Water absorption (23℃/24h) | ASTM D570 | ≤0.5% | ||
| Low temperature flexibility (-40℃/4h) | ASTM D2671 | No cracks | ||
| Heat shock(200℃/4h) | ASTM D2671 | No drips, no flow, no cracks | ||
| Dielectric strength | ASTM D2671 | ≥16 kV/mm | ||
| Volume resistivity | ASTM D2671 | ≥1.0×1013 Ω·cm | ||
| Outer layer/inner layer (black semiconducting layer) | ||||
| Tensile Strength | ASTM D2671 | ≥12 MPa | ||
| Breakdown elongation | ASTM D2671 | ≥300% | ||
| Aging(136℃/168h) Tensile Strength Breakdown elongation |
ASTM D2671 | ≥9.0 MPa ≥220% |
||
| Water absorption (23℃/24h) | ASTM D570 | ≤0.5% | ||
| Low temperature flexibility (-40℃/4h) | ASTM D2671 | No cracks | ||
| Heat shock(200℃/4h) | ASTM D2671 | No drips, no flow, no cracks | ||
| Volume resistivity | ASTM D2671 | ≤5×103 Ω·cm |
| Dimesion | ||||
| Size | As supplied(mm) | After shrink (mm) | Standard length | |
| GM-DID | Inner diameter（Min.） | Inner diameter（Max.） | Wall thickness（common） | m/roll |
| 100 | 100 | 55 | 2.7 | 6~24 |
| 120 | 120 | 65 | 2.7 | 6~24 |
| 130 | 130 | 70 | 2.7 | 6~24 |
| 140 | 140 | 75 | 2.7 | 6~24 |
| 150 | 150 | 80 | 2.7 | 6~24 |
| 180 | 180 | 85 | 2.7 | 6~24 |
| 200 | 200 | 90 | 2.7 | 6~24 |
Keyword:
GM-DID Semiconducting insulation semiconducting three-layer composite heat shrinkable tube for tube bus
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Address: Tangjia Industrial Park, Shihe Street, Puwan New District, Dalian
Tel： 0411-87166661 87166662 0411-87166663 87166665
International line： +86-411-87166669
E-mail： upolymer@upolymer.com
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